3D IC packaging involves stacking multiple silicon dies vertically using through-silicon vias (TSVs), enabling faster interconnects and enhanced performance. In contrast, 2.5D IC packaging places multiple dies side by side on an interposer, offering design flexibility and cost efficiency while maintaining high performance. Both approaches are widely adopted across applications such as... https://www.briefingwire.com/pr/3d-ic-and-25d-ic-packaging-market-transforming-advanced-semiconductor-integration